Standard
[CURRENT]
NF C96-022-14:2004-01-01
NF EN 60749-14:2004-01-01
Semiconductor devices - Mechanical and climatic test methods - Part 14: robustness of terminations (lead integrity)
- German title
- Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 14: festigkeit der Bauelementeanschlüsse (Unversehrtheit der Anschlüsse)
- Publication date
-
2004-01-01
- Original language
-
French
- Pages
- 16
- Publication date
-
2004-01-01
- Original language
-
French
- Pages
- 16
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