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Standards Worldwide
Standards Worldwide
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Standard [CURRENT]

NF C96-013-6-4:2003-11-01

NF EN 60191-6-4:2003-11-01

Mechanical standardization of semiconductor devices - Part 6-4 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-4 : allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Messverfahren für Gehäusemasse von Ball Grid Array (BGA)
Publication date
2003-11-01
Original language
French
Pages
21

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Publication date
2003-11-01
Original language
French
Pages
21

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