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Standards Worldwide
Standards Worldwide
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Standard [CURRENT]

NF C96-013-6-3:2001-04-01

NF EN 60191-6-3:2001-04-01

Mechnical standardization of semiconductor devices - Part 6-3 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

German title
Mechanische Normung von Halbleiterbauelemente - Teil 6-3 : Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitegeäusen - Messverfahren für QFP-Gehäusemasse
Publication date
2001-04-01
Original language
English
Pages
19

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Publication date
2001-04-01
Original language
English
Pages
19

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