Device embedding assembly technology - Part 2-602 : guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
German title
Montageverfahren für eingebettete Bauteile - Teil 2-602 : Leitfaden für gestapelte Elektronikmodule - Verfahren zur Beurteilung der elektrischen Verbindungsfähigkeit zwischen den Modulen
Publication date
2021-08-13
Original language
French
Pages
16
Publication date
2021-08-13
Original language
French
Pages
16
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