Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
German title
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-808: Thermischer Widerstand der dielektrischen Schicht durch thermische transiente Methode
Publication date
2024-05-31
Original language
French
Pages
24
Publication date
2024-05-31
Original language
French
Pages
24
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