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Standard [CURRENT]

IPC JEDEC 9707:2011-09-13

Spherical Bend Test Method for Characterization of Board Level Interconnects

Publication date
2011-09-13
Original language
English
Pages
15

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Publication date
2011-09-13
Original language
English
Pages
15

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Replacement amendments

This document has been modified by: IPC JEDEC 9707 AMD 1:2018-05-01

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