Standard
[CURRENT]
IPC JEDEC 9707 AMD 1:2018-05-01
Spherical Bend Test Method for Characterization of Board Level Interconnects
- Publication date
-
2018-05-01
- Original language
-
English
- Pages
- 7
- Publication date
-
2018-05-01
- Original language
-
English
- Pages
- 7
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