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IEC 61191-6:2010-01

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

German title
Elektronikaufbauten auf Leiterplatten - Teil 6: Bewertungskriterien für Hohlräume in Lötverbindungen von BGA und LGA und Messmethode
Publication date
2010-01
Original language
English, French
Pages
76
Publication date
2010-01
Original language
English, French
Pages
76

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