Standard
[CURRENT]
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IEC 61191-6:2010-01
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
- German title
- Elektronikaufbauten auf Leiterplatten - Teil 6: Bewertungskriterien für Hohlräume in Lötverbindungen von BGA und LGA und Messmethode
- Publication date
-
2010-01
- Original language
-
English,
French
- Pages
- 76
- Publication date
-
2010-01
- Original language
-
English,
French
- Pages
- 76
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