Standard
[CURRENT]
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IEC 61191-3:2017-05
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
- German title
- Elektronikaufbauten auf Leiterplatten - Teil 3: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Durchsteckmontage
- Publication date
-
2017-05
- Original language
-
English
- Pages
- 20
- Publication date
-
2017-05
- Original language
-
English
- Pages
- 20
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