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IEC 61191-3:2017-05

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

German title
Elektronikaufbauten auf Leiterplatten - Teil 3: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Durchsteckmontage
Publication date
2017-05
Original language
English
Pages
20
Publication date
2017-05
Original language
English
Pages
20

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