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IEC 61189-5:2006-08

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

German title
Prüfverfahren für Elektromaterialien, Verbindungsstrukturen und Baugruppen - Teil 5: Prüfverfahren für bestückte Leiterplatten
Publication date
2006-08
Original language
English, French
Pages
120
Publication date
2006-08
Original language
English, French
Pages
120

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