IEC 61189-5-3:2015-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

German title: Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 5-3: Allgemeine Prüfverfahren für Materialien und Baugruppen - Lotpaste für bestückte Leiterplatten
Publication date: 2015-01
Original language: English, French
Pages: 79

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