IEC 61189-5-2:2015-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods materials and assemblies - Soldering flux for printed board assemblies

German title: Prüfverfahren für Elektromaterialien, Verbindungsstrukturen und Baugruppen - Teil 5-2: Prüfverfahren für bestückte Leiterplatten: Teil Lötflussmittel
Publication date: 2015-01
Original language: English, French
Pages: 83

Product information on this site:

Quick delivery via download or delivery service

Buy securely with a credit card or pay upon receipt of invoice

All transactions are encrypted

Loading recommended items...