Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 40: Prüfverfahren zum Fall einer Leiterplatte unter Verwendung von Dehnungsmessstreifen
Publication date
2011-07
Original language
English,
French
Pages
44
Publication date
2011-07
Original language
English,
French
Pages
44
Product information on this site:
Quick delivery via download or delivery service
Buy securely with a credit card or pay upon receipt of invoice