We use cookies to make our websites more user-friendly and to continuously improve them. If you continue to use the website, you consent to the use of cookies. You can find more information in our privacy statement and our cookie guidelines.

Dear Customer

Our Customer Service will be available again as of 2 January 2025. 

Please note that new registrations and requests to be processed manually will only be processed from this point onwards.

You can of course place orders and receive downloads online at any time.

We wish you happy holidays, a peaceful time and a healthy New Year!

Your DIN Media

Standards Worldwide
Standards Worldwide
Phone +49 30 58885700-07

Standard [CURRENT] Article is not orderable

IEC 60749-22:2002-09

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 22: Kontaktfestigkeit
Publication date
2002-09
Original language
English, French
Pages
41
Publication date
2002-09
Original language
English, French
Pages
41

Product information on this site:

Quick delivery via download or delivery service

Buy securely with a credit card or pay upon receipt of invoice

All transactions are encrypted

Replacement amendments

This document has been modified by: IEC 60749-22 Corrigendum 1:2003-08

Loading recommended items...
Loading recommended items...
Loading recommended items...
Loading recommended items...