IEC 60749-22:2002-09

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

German title: Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 22: Kontaktfestigkeit
Publication date: 2002-09
Original language: English, French
Pages: 41

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Replacement amendments

This document has been modified by: IEC 60749-22 Corrigendum 1:2003-08

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