Standard
[CURRENT]
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IEC 60749-21:2011-04
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
- German title
- Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 21: Lötbarkeit
- Publication date
-
2011-04
- Original language
-
English,
French
- Pages
- 44
- Publication date
-
2011-04
- Original language
-
English,
French
- Pages
- 44
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