IEC 60749-16:2003-01

Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

German title: Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 16: Nachweis des Teilchen-Aufprallgeräusches (PIND)
Publication date: 2003-01
Original language: English, French
Pages: 22

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