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IEC 60749-15:2020-07

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 15: Beständigkeit gegen Löttemperatur bei Bauelementen zur Durchsteckmontage
Publication date
2020-07
Original language
English, French
Pages
17
Publication date
2020-07
Original language
English, French
Pages
17

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