Standard
[CURRENT]
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IEC 60749-15:2020-07
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
- German title
- Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 15: Beständigkeit gegen Löttemperatur bei Bauelementen zur Durchsteckmontage
- Publication date
-
2020-07
- Original language
-
English,
French
- Pages
- 17
- Publication date
-
2020-07
- Original language
-
English,
French
- Pages
- 17
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