Standard
[CURRENT]
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IEC 60749-14:2003-08
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
- German title
- Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 14: Festigkeit der Bauelementeanschlüsse (Unversehrtheit der Anschlüsse)
- Publication date
-
2003-08
- Original language
-
English,
French
- Pages
- 36
- Publication date
-
2003-08
- Original language
-
English,
French
- Pages
- 36
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