IEC 60191-6-4:2003-06

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

German title: Mechanische Normung von Halbleiterbauelementen - Teil 6-4: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Messverfahren für Gehäusemaße von Ball Grid Array (BGA)
Publication date: 2003-06
Original language: English, French
Pages: 32

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