IEC 60191-6-3:2000-09

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quad flat packs (QFP)

German title: Mechanische Normung von Halbleiterbauelementen - Teil 6-3: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen; Messverfahren für QFP-Gehäusemaße
Publication date: 2000-09
Original language: English, French
Pages: 34

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