Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-19: Messverfahren für die Gehäuse-Verbiegung bei erhöhter Temperatur und die maximal zulässige Verbiegung
Publication date
2010-02
Original language
English,
French
Pages
25
Publication date
2010-02
Original language
English,
French
Pages
25
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