IEC 60191-6-18:2010-01

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

German title: Mechanische Normung von Halbleiterbauelementen - Teil 6-18: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Ball-Grid-Array (BGA)
Publication date: 2010-01
Original language: English, French
Pages: 40

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Replacement amendments

This document has been modified by: IEC 60191-6-18 Corrigendum 1:2010-05,IEC 60191-6-18 Corrigendum 2:2010-07

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