IEC 60191-5:1997-04

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

German title: Mechnische Normung von Halbleiterbauelementen - Teil 5: Empfehlungen zum automatischen Filmbonden (TAB) von integrierten Schaltungen
Publication date: 1997-04
Original language: English, French
Pages: 71

Product information on this site:

Quick delivery via download or delivery service

Buy securely with a credit card or pay upon receipt of invoice

All transactions are encrypted

Loading recommended items...