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IEC 60191-5:1997-04

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

German title
Mechnische Normung von Halbleiterbauelementen - Teil 5: Empfehlungen zum automatischen Filmbonden (TAB) von integrierten Schaltungen
Publication date
1997-04
Original language
English, French
Pages
71
Publication date
1997-04
Original language
English, French
Pages
71

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