Environmental Testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
German title
Umweltprüfungen - Teil 2-83: Prüfungen - Prüfung Tf: Prüfung der Lötbarkeit von Bauelementen der Elektronik für Oberflächenmontage (SMD) mit der Benetzungswaage unter Verwendung von Lotpaste
Publication date
2011-09
Original language
English
Pages
76
Publication date
2011-09
Original language
English
Pages
76
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