Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quad flat packs (QFP) (IEC 60191-6-3:2000)
German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-3: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen; Messverfahren für QFP-Gehäusemaße (IEC 60191-6-3:2000)
Publication date
2000-12
Original language
English
Publication date
2000-12
Original language
English
Product information on this site:
Quick delivery via download or delivery service
Buy securely with a credit card or pay upon receipt of invoice
All transactions are encrypted
Cooperation at DIN
Please get in touch with the relevant contact person at DIN if you have problems understanding the content of the standard or need advice on how to apply it.