Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 62878-2-602:2021); German version EN IEC 62878-2-602:2021
German title
Montageverfahren für eingebettete Bauteile - Teil 2-602: Leitfaden für gestapelte Elektronikmodule - Verfahren zur Beurteilung der elektrischen Verbindungsfähigkeit zwischen den Modulen (IEC 62878-2-602:2021); Deutsche Fassung EN IEC 62878-2-602:2021
Publication date
2022-08
Original language
German
Pages
14
Publication date
2022-08
Original language
German
Pages
14
DOI
https://dx.doi.org/10.31030/3354849
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ICS
31.180,
31.190
DOI
https://dx.doi.org/10.31030/3354849
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