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Standard [CURRENT]

DIN EN IEC 61249-2-51:2024-02

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad (IEC 61249-2-51:2023); German version EN IEC 61249-2-51:2023

German title
Werkstoffe für Leiterplatten und andere Verbindungsstrukturen - Teil 2-51: Kaschierte und unkaschierte verstärkte Basismaterialien - Basismaterial als Chipträger, nicht kaschiert (IEC 61249-2-51:2023); Deutsche Fassung EN IEC 61249-2-51:2023
Publication date
2024-02
Original language
German
Pages
19

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Publication date
2024-02
Original language
German
Pages
19
DOI
https://dx.doi.org/10.31030/3501844

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ICS
31.180
DOI
https://dx.doi.org/10.31030/3501844

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