Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (IEC 61189-2-803:2023); German version EN IEC 61189-2-803:2023
German title
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-803: Prüfverfahren für die Z-Achsen-Ausdehnung von Basismaterialien und Leiterplatten (IEC 61189-2-803:2023); Deutsche Fassung EN IEC 61189-2-803:2023
Publication date
2024-08
Original language
German
Pages
10
Publication date
2024-08
Original language
German
Pages
10
DOI
https://dx.doi.org/10.31030/3543608
Product information on this site:
Quick delivery via download or delivery service
Buy securely with a credit card or pay upon receipt of invoice
Please get in touch with the relevant contact person at DIN if you have problems understanding the content of the standard or need advice on how to apply it.