Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (IEC 61189-2-803:2023); German version EN IEC 61189-2-803:2023
German title
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-803: Prüfverfahren für die Z-Achsen-Ausdehnung von Basismaterialien und Leiterplatten (IEC 61189-2-803:2023); Deutsche Fassung EN IEC 61189-2-803:2023
Publication date
2024-08
Original language
German
Pages
10
Publication date
2024-08
Original language
German
Pages
10
DOI
https://dx.doi.org/10.31030/3543608
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ICS
31.180
DOI
https://dx.doi.org/10.31030/3543608
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