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Standard [CURRENT]

DIN EN 62258-2:2011-12

Semiconductor die products - Part 2: Exchange data formats (IEC 62258-2:2011); English version EN 62258-2:2011

German title
Halbleiter-Chip-Erzeugnisse - Teil 2: Datenaustausch-Formate (IEC 62258-2:2011); Englische Fassung EN 62258-2:2011
Publication date
2011-12
Original language
English
Pages
69

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Publication date
2011-12
Original language
English
Pages
69
DOI
https://dx.doi.org/10.31030/1817709

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Overview

The IEC 62258 standard series has been prepared to facilitate the production, supply and use of semiconductor die products. This part of the standard series specifies the data formats for the exchange of data and specifies the device data exchange (DDX) format with the prime goal of facilitating the transfer of adequate geometric data between die manufacturer and CAD/CAE user when designing electronic circuits, and formal information models that allow data exchange in other formats. Minimum requirements for the data necessary for description of die products for the design and procurement of components, the special requirements for the data necessary for the description of geometric characteristics of semiconductor die products, their physical properties and means of connection necessary for their use during the development and manufacture, as well as the corresponding terminology and a list of often used acronyms are given in DIN EN 62258-1 (VDE 0884-101):2011-04. As the users of this document use the English language as technical language, the content of this standard is published in English. This goes back to a suggestion within the framework of the discussion of comments to the standard DIN EN 62258-2:2005-12, has been repeatedly confirmed by staff of the responsible DKE/K 631 and has been advocated within the framework of the approval procedure aimed at this purpose by the technical advisory board of international and national coordination (TBINK) of the DKE and approved by the management of DIN. This standard is not directly related to legal provisions and shall not be considered a safety standard. The IEC publication contained has been prepared by TC 47 "Semiconductor devices". This document is based on the work of the fourth ESPRIT Framework Project "GOOD DIE" which led to the publication of the series European Specification ES 59008 which was replaced by the standard series EN 62258 or IEC 62258. This document has been prepared by the organizations "ESPRIT ENCAST and ENCASIT Projects" and the "Die Products Consortium", JEITA, JEDEC and ZVEI. The following modifications have been made with respect to DIN EN 62258-2:2005-12: a) The document has been adapted to the DDX data format at version 1.3.0. b) Some parameters have been revised which are given in the foreword of EN 62258-2. The responsible committee is K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.

ICS
31.080.01, 35.040.99
DOI
https://dx.doi.org/10.31030/1817709
Replacement amendments

This document replaces DIN EN 62258-2:2005-12 .

Cooperation at DIN

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