DIN EN 62258-1:2011-04

This document draws on the work of the fourth ESPRIT framework project "GOOD-DIE" which lead to publishing the series of European Specifications ES 59008. The European IST-ENCASIT project and the organizations JEITA, JEDEC and ZVEI participated in the preparation of this document. The European Specifications ES 59008 have been transferred to the IEC publications of the IEC 62258 series and adopted by CENELEC as corresponding CLC documents. This part of DIN EN 62258 has been prepared in order to support manufacture, supply and application of semiconductor die products, including: - wafers; - individual bare dies; - dies and wafers with additional connection and interconnection structures; - dies and wafers with minimal or partial packages. In this standard, minimum requirements are specified for the necessary information in order to specify such die products, and it is intended to support during development and procurement of assemblies in which semiconductor die products are used. The standard contains requirements regarding data, including: - product designation; - product data; - mechanical information for dies; - testing, quality, assembly and reliability information; - handling, transportation and storage information. In this standard, special requirements are specified for the necessary information in order to describe the geometrical characteristics and physical characteristics of the dies, as well as the methods of construction and interconnection technology, if these are necessary during the development and manufacture of the products. The annexes in this standard contain a glossary and a list of general acronyms. With respect to DIN EN 62258-1:2006-04, the following amendments have been made: a) Due to the specifications in clause 10 about ESD, environmental protection and toxic materials the document will be incorporated into the VDE-Vorschriftenwerk (VDE rules and regulations); b) the Normative References have been updated; c) the sequence of clauses, in particular clause 6, has been changed in order to better correspond with the logic; d) the text of some requirements has been supplemented with information contained in CLC/TR 62258-4, CLC/TR 62258-7 and CLC/TR 62258-8; e) information regarding the interchangeability of terminals and functional units of a die component have been newly incorporated in 6.6.4; f) requirements for moisture sensitivity of partially encapsulated devices have been newly incorporated in 8.8. The responsible Committee is K 631 "Halbleiterbauelemente" ("Semiconductor components") of the DKE (German Commission for Electrical, Electronic and Informational Technologies) at DIN and VDE.