DIN EN 62228-2:2017-09

The Local Interconnect Network (LIN) is a standardized communication protocol and represents an economical solution for networks of, for example, electronic control devices, sensors and actuators which are primarily used in automobiles. The future requirements for automatic control systems in cars will continue to increase, while the pressure to minimize costs continues. Consequently, increased use of the Local Interconnect Network is to be expected. At the same time, it is important to meet the electromagnetic compatibility requirements of the integrated circuits with embedded LIN transceivers to ensure reliable operation of the local network, as is already the case with the CAN network. The evaluation procedures for CAN transceivers are already described in IEC/TS 62228-1 and are implemented here on the same basis. This document specifies test and measurement methods, test conditions, test configurations, procedures, failure criteria and test signals for the electromagnetic compatibility (EMC) assessment of integrated circuits with embedded LIN transceivers with respect to disturbances on signal and power supply lines. This includes - the emission of RF disturbances; - the immunity to RF disturbances and transients (function and damage) and - immunity to electrostatic discharge - ESD (damage). The number of test methods is limited to a necessary minimum in order to reduce the testing effort and improve the consistency of the results of different types of transceivers. The direct 150-Ώ-coupling, DPI and the direct galvanic and capacitive coupling methods were selected for the evaluation of the EMC characteristics of active transceivers. The annexes provide specifications for the test PCBs to be used, examples of test limits for LIN transceivers in automotive equipment and a description of indirect electrostatic discharge testing. The responsible committee is DKE/K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.