Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006); German version EN 62047-2:2006
German title
Halbleiterbauelemente - Bauteile der Mikrosystemtechnik - Teil 2: Prüfverfahren zur Zugbeanspruchung bei Dünnschicht-Werkstoffen (IEC 62047-2:2006); Deutsche Fassung EN 62047-2:2006
Publication date
2007-02
Original language
German
Pages
14
Publication date
2007-02
Original language
German
Pages
14
DOI
https://dx.doi.org/10.31030/9782030
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ICS
31.080.01,
31.220.01
DOI
https://dx.doi.org/10.31030/9782030
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