DIN EN 62047-1:2016-12

The use of uniform terms is an essential factor for standardization in order to arrive at uniform and consistent definitions. This applies all the more to new and innovative technologies that are subject to many different terms and definitions from research and development. This document defines terms for micro-electromechanical devices (MST) including the process of production of such devices. In addition to the definitions, it contains general explanations and important aspects of MST devices in notes for almost every term. The document is the revision of DIN EN 62047-1:2006 and includes the German translation of IEC 62047-1:2016, so the initial experience in establishing uniform microsystems technology terms has been incorporated into this document. In addition to the adaptation of the German title to the most recently published parts of this series of standards, the following changes in content in particular resulted compared to DIN EN 62047-1:2006: - newly included terms: electrowetting on dielectrics, static friction, CMOS MEMS device, surface modification, chemical-mechanical polishing, laser cutting, supercritical drying, atomic layer deposition, self-assembling monolayer, nanoimprint, surface-activated bonding, silicon vias, spectroscopic ellipsometry, power MEMS and energy harvesting; - the definitions of the terms MEMS, MEMS technology, micro science and engineering, micromechanical processing, etch stopper, reactive ion deep etching, and near-field microscope have been revised; - terms no longer needed have been deleted; - the German language version has been editorially revised. The responsible committee is DKE/K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.