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Standard [WITHDRAWN]

DIN EN 61190-1-3:2003-01

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2002); German version EN 61190-1-3:2002

German title
Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-3: Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von Elektronikprodukten (IEC 61190-1-3:2002); Deutsche Fassung EN 61190-1-3:2002
Publication date
2003-01
Original language
German
Pages
36

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Publication date
2003-01
Original language
German
Pages
36

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This document has been replaced by: DIN EN 61190-1-3:2007-11 .

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