Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:2007); German version EN 61189-3:2008
German title
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 3: Prüfverfahren für Verbindungsstrukturen (Leiterplatten) (IEC 61189-3:2007); Deutsche Fassung EN 61189-3:2008
Publication date
2008-06
Original language
German
Pages
120
Publication date
2008-06
Original language
German
Pages
120
DOI
https://dx.doi.org/10.31030/1426533
Product information on this site:
Quick delivery via download or delivery service
Buy securely with a credit card or pay upon receipt of invoice
Please get in touch with the relevant contact person at DIN if you have problems understanding the content of the standard or need advice on how to apply it.