DIN EN 60749-9:2017-11

The suitability of semiconductor components for various applications also depends on the climatic and mechanical environmental influences to which these components are exposed. The DIN EN 60749 series of standards contains a large number of different test methods for this purpose. The test procedure defined in this part of the series of standards is used to prove that markings on semiconductor components do not become illegible when they are exposed to solvents or cleaning solutions that are normally used in the manufacturing process to remove solder flux residues from the printed circuit board. The procedure is applicable to all package types and is suitable for qualification and/or process monitoring. The main change compared to the previous edition of this standard is the addition of an adhesive tape test. The responsible committee is DKE/K 631 "Halbleiterbauelemente" ("Semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.