Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components (IEC 60749-35:2006); German version EN 60749-35:2006
German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 35: Ultraschallmikroskopie für kunststoffverkappte Bauelemente der Elektronik (IEC 60749-35:2006); Deutsche Fassung EN 60749-35:2006
Publication date
2007-03
Original language
German
Pages
21
Publication date
2007-03
Original language
German
Pages
21
DOI
https://dx.doi.org/10.31030/9832621
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ICS
31.080.01
DOI
https://dx.doi.org/10.31030/9832621
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