Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance (IEC 60352-8:2011); German version EN 60352-8:2011
German title
Lötfreie Verbindungen - Teil 8: Druckmontage-Verbindungen - Allgemeine Anforderungen, Prüfverfahren und Anwendungshinweise (IEC 60352-8:2011); Deutsche Fassung EN 60352-8:2011
Publication date
2011-12
Original language
German
Pages
23
Publication date
2011-12
Original language
German
Pages
23
DOI
https://dx.doi.org/10.31030/1813694
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Overview
This standard specifies requirements and tests for compression mount connections with metallic spring contacts. Furthermore it contains practical guidance information and information on materials and data from industrial experience. A compression mount connection is a solderless connection between a compression mount contact and a contact pad which is established by a continuous compression force. The responsible Committee is K 651 "Steckverbinder" ("Connectors") of the DKE (German Commission for Electrical, Electronic and Information Technologies) of DIN and VDE.
ICS
31.220.10
DOI
https://dx.doi.org/10.31030/1813694
Cooperation at DIN
Please get in touch with the relevant contact person at DIN if you have problems understanding the content of the standard or need advice on how to apply it.