DIN EN 60286-3:2014-02

This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the abovementioned purposes. Tape packaging meets the requirements of automatic component placement machines and also covers the use of tape packaging for components and singulated dies for test purposes and other operations. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). The tapes are available in various types: - type 1 are punched and pressed carrier tapes. Type 1a is a punched carrier tape, with top and bottom cover tape (tape widths: 8 mm and 12 mm), type 1b is a pressed carrier tape, with top cover tape (tape width: 8 mm); - type 2 are blister carrier tapes with single round sprocket holes. Type 2a is a blister carrier tape, with single round sprocket holes and tape pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm), type 2b is a blister carrier tape, with single round sprocket holes and with 1mm tape pitch (tape widths: 4 mm); - type 3 is a blister carrier tape, with double sprocket holes (32 mm to 200 mm), - type 4 is an adhesive-backed punched plastic carrier tape for singulated bare die and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) The following technical changes have been made with respect to EN 60286-3:2007: - integration of EN 60286-3-1:2009 as type 1b (Packaging of surface mount components on continuous pressed carrier tapes); - integration of EN 60286-3-2:2009 as type 2b (Packaging of surface mount components on blister carrier tapes 4 mm in width). The responsible committee is DKE/K 682 "Montageverfahren für elektronische Baugruppen" ("Electronics assembly technology") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.