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Standard [CURRENT]

DIN EN 60191-6-8:2002-05

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001

German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-8: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen; Konstruktionsleitfaden für Glas-Keramik-Quad-Flatpack (G-QFP); (IEC 60191-6-8:2001); Deutsche Fassung EN 60191-6-8:2001
Publication date
2002-05
Original language
German
Pages
14

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Publication date
2002-05
Original language
German
Pages
14
DOI
https://dx.doi.org/10.31030/9240836

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ICS
01.100.25, 31.240
DOI
https://dx.doi.org/10.31030/9240836

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