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Standard [CURRENT]

DIN EN 60191-6-4:2004-01

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003

German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-4: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen; Messverfahren für Gehäusemaße von Ball Grid Array (BGA) (IEC 60191-6-4:2003); Deutsche Fassung EN 60191-6-4:2003
Publication date
2004-01
Original language
German
Pages
20

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Publication date
2004-01
Original language
German
Pages
20
DOI
https://dx.doi.org/10.31030/9524259

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ICS
01.100.25, 31.240
DOI
https://dx.doi.org/10.31030/9524259

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