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Standard [WITHDRAWN]

DIN EN 16602-70-08:2015-05

Space product assurance - Manual soldering of high-reliability electrical connections; English version EN 16602-70-08:2015

German title
Raumfahrtproduktsicherung - Manuelles Löten von hoch-zuverlässigen elektrischen Verbindungen; Englische Fassung EN 16602-70-08:2015
Publication date
2015-05
Original language
English
Pages
113

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Publication date
2015-05
Original language
English
Pages
113
DOI
https://dx.doi.org/10.31030/2300285

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Overview

This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of manually-soldered, high-reliability electrical connections. The Standard defines acceptance and rejection criteria for high reliability manufacture of manually-soldered electrical connections intended to withstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight. The proper tools, correct materials, design and workmanship are covered by this document. Workmanship standards are included to permit discrimination between proper and improper work. The assembly of surface-mount devices is covered in ECSS-Q-ST-70-38. Requirements related to printed circuit boards are contained in ECSS-Q-ST-70-10 and ECSS-Q-ST-70-11. Verification of manual soldering assemblies which are not described in this standard is performed by vibration and thermal cycling testing. The requirements for verification are given in this Standard. This standard does not cover the qualification and acceptance of EQM and FM equipment with hand soldered connections. The qualification and acceptance tests of equipment manufactured in accordance with this Standard are covered by ECSS-E-ST-10-03. The mounting and supporting of components, terminals and conductors prescribed herein applies to assemblies designed to operate within the temperature limits of -55 °C to +85 °C. For temperatures outside this normal range, special design, verification and qualification testing is performed to ensure the necessary environmental survival capability. Special thermal heat sinks are applied to devices having high thermal dissipation (for example, junction temperatures of 110 °C, power transistors) in order to ensure that solder joints do not exceed 85 °C. This standard may be tailored for the specific characteristic and constraints of a space project in conformance with ECSS-S-ST-00. This document (EN 16602-70-10:2015) has been prepared by Technical Committee CEN/CLC/TC 5 "Space", the secretariat of which is held by DIN (Germany). This document has been developed to specifically cover space systems and therefore has precedence over any European Standard since it covers the same scope but with a wider domain of applicability (for example aerospace). The responsible German body is Working Committee NA 131-10-01 AA "Interoperabilität von Informations-, Kommunikations- und Navigationssystemen" ("Interoperability of information, communication and navigation systems") of the Aerospace Standards Committee (NL) at DIN.

Content
ICS
25.160.50, 49.140
DOI
https://dx.doi.org/10.31030/2300285
Replacement amendments

This document has been replaced by: DIN EN 16602-70-61:2023-01 .

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