Semiconductor devices. Micro-electromechanical devices. Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area
German title
Halbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Siliziumbasierte MEMSHerstellungstechnologie. Messverfahren zur Zug-Druckund Scherfestigkeit gebondeter Flächen im Mikrometerbereich
Publication date
2016-11-30
Original language
English
Pages
28
Publication date
2016-11-30
Original language
English
Pages
28
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