Mechanical standardization of semiconductor devices. Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
German title
Mechanische Normung von Halbleiterbauelementen. Messverfahren für die Gehäuse-Verbiegung bei erhöhter Temperatur und die maximal zulässige Verbiegung
Publication date
2010-06-30
Original language
English
Pages
18
Publication date
2010-06-30
Original language
English
Pages
18
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