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Draft standard

DIN EN IEC 63215-5:2022-06 - Draft

Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices (IEC 91/1770/CD:2021); Text in German and English

German title
Verfahren für die Haltbarkeitsprüfung von Werkstoffen zum Chip-Bonden - Teil 5: Verfahren für die Temperaturwechselprüfung und Funktionsfähigkeitsindex von Werkstoffen zum Chip-Bonden zur Verwendung an leistungselektronischen Bauelementen (IEC 91/1770/CD:2021); Text Deutsch und Englisch
Date of issue
2022-05-27
Publication date
2022-06
Original language
German, English
Pages
28

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Date of issue
2022-05-27
Publication date
2022-06
Original language
German, English
Pages
28
DOI
https://dx.doi.org/10.31030/3354416

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ICS
31.190
DOI
https://dx.doi.org/10.31030/3354416

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