Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 91/1802/CD:2022); Text in German and English
German title
Technologie zur Einbettung von Bauelementen - Teil 2-603: Leitfaden für gestapelte elektronische Module - Prüfverfahren für die elektrische Konnektivität innerhalb des Moduls (IEC 91/1802/CD:2022); Text Deutsch und Englisch
Date of issue
2023-06-30
Publication date
2023-07
Original language
German,
English
Pages
22
Date of issue
2023-06-30
Publication date
2023-07
Original language
German,
English
Pages
22
DOI
https://dx.doi.org/10.31030/3440912
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ICS
31.180,
31.190
DOI
https://dx.doi.org/10.31030/3440912
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