Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 91/1786/CD:2022); Text in German and English
German title
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-720: Detektion von Defekten in Verbindungsstrukturen durch Kapazitätsmessung (IEC 91/1786/CD:2022); Text Deutsch und Englisch
Date of issue
2022-08-19
Publication date
2022-09
Information
To be withdrawn in 2025-01 and replaced by: DIN EN IEC 61189-2-720, edition:2025-01
Original language
German,
English
Pages
19
Date of issue
2022-08-19
Publication date
2022-09
Information
To be withdrawn in 2025-01 and replaced by: DIN EN IEC 61189-2-720, edition:2025-01
Original language
German,
English
Pages
19
DOI
https://dx.doi.org/10.31030/3374841
Product information on this site:
Quick delivery via download or delivery service
Buy securely with a credit card or pay upon receipt of invoice
All transactions are encrypted
ICS
31.180
DOI
https://dx.doi.org/10.31030/3374841
Cooperation at DIN
Please get in touch with the relevant contact person at DIN if you have problems understanding the content of the standard or need advice on how to apply it.