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Standard [CURRENT]

UNE-EN IEC 61189-5-601:2021-04-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (Endorsed by Asociación Española de Normalización in April of 2021.)

Publication date
2021-04-01
Original language
English
Pages
46

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Publication date
2021-04-01
Original language
English
Pages
46

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