Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (Endorsed by Asociación Española de Normalización in January of 2017.)
Publication date
2017-01-01
Original language
English
Pages
23
Publication date
2017-01-01
Original language
English
Pages
23
Product information on this site:
Quick delivery via download or delivery service
Buy securely with a credit card or pay upon receipt of invoice