Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) (Endorsed by AENOR in December of 2001.)
Publication date
2001-12-01
Original language
English
Pages
17
Publication date
2001-12-01
Original language
English
Pages
17
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